Shielding Cover Stamping Parts

Our shielding enclosures are manufactured using precision stamping techniques to create thin-walled enclosures, perfectly meeting the demands of electronic products for electromagnetic shielding, physical protection, miniaturization, and lightweight design.

Shielding Cover Stamping Parts

 

Shielding Cover Stamping Parts

Shielding Cover Stamping Parts

Shielding Cover Stamping Parts

Shielding Cover Stamping Parts

Shielding Cover Stamping Parts

Shielding Cover Stamping Parts

Shielding Cover Stamping Parts

Shielding Cover Stamping Parts

 

Shielding enclosure stamping parts are primarily used in electronic and communication equipment, with their core functions being electromagnetic shielding (EMI/RFI Shielding) and physical protection. Specific application scenarios include:

Electromagnetic Compatibility (EMC) Protection:

Preventing Electromagnetic Interference: Enclosing sensitive or high-frequency circuits such as chips, RF modules (e.g., Wi-Fi, Bluetooth, GPS), and oscillators to prevent them from radiating electromagnetic waves that could interfere with other components or external devices.

Resisting External Interference: Protecting internal sensitive circuits from electromagnetic interference originating outside the device or from other internal modules, ensuring signal integrity and stable device operation.

Physical Protection:

Dust and Tamper Protection: Provides an enclosed space for precision electronic components, preventing dust and foreign objects from entering while guarding against accidental contact damage during production, assembly, or maintenance.

Thermal Assistance: Some shield designs incorporate heat dissipation features, conducting heat away through surface contact with chip thermal pads. Others include top ventilation holes or raised surfaces to increase heat dissipation area.

Signal Isolation:

On a single circuit board, when multiple RF/high-frequency modules with different functions coexist, independent shields isolate them to prevent signal crosstalk (e.g., in smartphones, the main processor, cellular RF, and Wi-Fi modules are typically shielded separately).

Primary Application Areas:

Smartphones, Tablets, Wearables: The most widespread application area, with nearly every device containing multiple shields of varying shapes.

Network Communication Equipment: Routers, switches, optical modules, base station equipment, etc.

Computers and Peripherals: Motherboards (especially high-end graphics cards and laptop motherboards), solid-state drives, TV boxes, etc.

Automotive Electronics: In-vehicle infotainment systems, radar, controllers, etc.

Medical Electronics and Industrial Control Equipment: Applications demanding high stability and interference resistance.

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