0.06 beryllium copper gold-plated spring contact
0.06mm ultra-thin beryllium copper gold-plated spring contacts, whose thickness demonstrates precision stamping and machining capabilities, are suitable for highly integrated, space-constrained modern electronic devices.
0.06 beryllium copper gold-plated spring contact
0.06 mm (i.e., 0.06 thick) beryllium copper gold-plated spring contact

0.06 beryllium copper gold plated spring
I. Primary Applications
Our spring contacts deliver stable, low-resistance, durable electrical connections and mechanical contacts, commonly used in the following scenarios:
High-Reliability Electronic Equipment:
Aerospace and Defense: Circuit connections in missiles, satellites, radars, and flight control systems requiring reliability under extreme conditions.
Medical Devices: Life monitors, implantable medical devices, and high-end diagnostic equipment where contact failure could lead to severe consequences.
Automotive electronics: Critical safety components like airbag controllers, ABS systems, and engine ECUs.
High-frequency and low-level signal transmission:
RF connections: Grounding and continuity between shielded chambers or modules in microwave devices, antennas, and base station equipment. Gold plating ensures excellent signal integrity.
Test and measurement instruments: Contact points in precision test probes and chip test sockets require long-term stable contact resistance.
Precision and miniaturized devices:
Micro connectors/electromagnetic shielding: Used in smartphones, smartwatches, and high-end laptops for grounding and EMI shielding between motherboards and shielding covers (as shielding spring contacts) or for FPC (flexible printed circuit) connections.
Precision switches/relays: Function as critical contact points.
Harsh environment applications:
Equipment requiring resistance to vibration, shock, thermal cycling, and moderately corrosive environments.
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